From September 20 to 23, the 2026 World Manufacturing Convention was held at the Binhu International Convention and Exhibition Center in Hefei, Anhui Province. Under the theme Smart Manufacturing, Creating a Better World, the product director of Jingci New Materials attended the Semiconductor Industry Innovation Development Matchmaking Session held alongside the convention, exchanging views on semiconductor material innovation and industrial collaboration with upstream and downstream company representatives and university experts.

The 2026 World Manufacturing Convention was approved by the State Council and jointly hosted by the People's Government of Anhui Province, the National Manufacturing Strategy Advisory Committee, the China Association of Small and Medium Enterprises and the Global Alliance of SMEs. Focusing on emerging industries such as intelligent connected new energy vehicles, next-generation information technology and artificial intelligence, the convention's automotive supply chain and semiconductor exhibition gathered nearly 400 well-known industry companies, covering semiconductor manufacturing equipment and materials, IC design and chips, packaging and testing, and presenting the complete industry chain from chips to end products.

Themed New Quality Chip Momentum, Linking a New Future, the matchmaking session was grounded in Anhui's industrial foundation in integrated circuits, AI computing power, energy storage and new energy vehicles, connecting the full chain of chip, packaging and thermal-management new materials. Combining keynote reports, technical sharing, roundtable dialogues, achievement releases and industry-chain matchmaking, it promoted technological innovation, project investment and precise supply-demand implementation.

During the session, the company's product director held in-depth exchanges with participating company representatives on application requirements for high-purity alumina ceramic powders in semiconductor equipment structural components, CMP polishing abrasives and packaging materials, learned about the latest selection requirements of leading downstream customers regarding particle size distribution, dispersibility and batch consistency, and introduced the volume delivery capability of the company's 3N and 4N product series to a number of potential customers.

Anhui is a major cluster of the integrated circuit and new display industries in China, where demand for semiconductor materials keeps growing. Through this session, the company moved closer to the Yangtze River Delta semiconductor industry cluster, accumulating resources for expanding customers in East China and deepening industry-chain collaboration.

Jingci New Materials focuses on the R&D and production of fine alumina ceramic powders for the semiconductor and aerospace fields. Its products cover particle sizes from 175nm to 500nm, with narrow particle size distribution, good dispersibility and consistent batch performance as the core direction. The company will continue to take part in high-level industry events, follow the development trends of the semiconductor industry chain, and provide customers downstream with highly stable and highly consistent powder solutions.

Convention information based on public reports by Xinhua News Agency, ifeng Anhui and Anhui Economic Network.