As the core substrate for high-end electronic ceramics, high-performance alumina powder exhibits outstanding properties such as high insulation, low dielectric loss, high thermal conductivity, high sintered density and chemical stability, which underpin the miniaturization and high-frequency development of electronic components. This material can be fabricated into integrated circuit packaging substrates, dielectric ceramic components for multi-layer ceramic capacitors, 5G/6G filters, resonators, copper-clad ceramic substrates for power modules, and heat sinks for light-emitting diodes. High-purity powder can effectively avoid electric leakage and signal interference caused by metallic impurities, while precise particle size grading helps guarantee dimensional accuracy and sintering uniformity of green ceramic bodies.
In addition, it can be used to manufacture precision components in semiconductor manufacturing processes such as ceramic chucks and chamber liners, featuring excellent high-temperature resistance and plasma corrosion resistance. At present, High-end alumina powder in China has long been dependent on imports, but independently developed domestic high-performance alumina powder helps break relevant technical barriers and realize independent and controllable supply of key materials in chip, communication and new energy electronics industrial chains.